Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.
OR L0 according to EN and IPC standards
Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.
Interflux® OSPI 3311M is a no-clean flux that especially has been developed for high volume soldering of OSP-boards that have passed one or more reflow processes.
OSPI 3311M is an optimised version of OSPI 3311 for residue formation and odour.
Most OSP-finishings will degrade quickly after reflow, making (through hole) wetting in wave or selective soldering a challenge, especially with lead-free alloys.
The elements of OSPI 3311M have been carefully chosen to promote (through hole) wetting on these degraded OSPs, especially with high conveyor speeds and low preheat temperatures.
Moreover, the flux is absolutely halogen free and has been designed to be safe and reliable.
OSPI 3311M meets IPC requirements.
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
It provides increased chances to pass harsh environmental tests as sometimes required in the automotive industry.
Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications, typically used in hand soldering and rework and repair.