Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag)  alloys. IF 14 is also available in lead-free alloys.
RE L0 to EN and IPC standards
SnPb(Ag) : 0,6%, 0,9% and 1,4% of flux content (IF 14-06, IF 14-09, IF 14-14)
Lead-free :1,6% and 2,2% of flux content (IF 14-16 and IF 14-22)

Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver,... as well as on degraded and oxidized surfaces.

Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
OR H1 to EN and IPC standards
Flux content: 2,5%

Interflux® Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
RO L0 to EN and IPC standards
Flux content: 2,2% and 3,5%

Interflux® NH 1 is an activated no-clean colophony free and lead-free solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass. NH 1 provides fast wetting and low spattering making it particularly suitable for robot and laser soldering but also for normal hand soldering.

Interflux® QF 70 is an absolutely halide-free, no-clean lead-free solder wire with fast wetting for fast soldering operations. QF 70 can be used in both hand soldering and automated soldering processes.

Interflux® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.

Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability in lead-free and SnPb(Ag) alloys. RosIX 705 can be used on surfaces that are difficult to solder like e.g. OSP, Ni, Zn, brass, German silver,... as well as on degraded and oxidized surfaces.

Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag)  alloys. IF 14 is also available in lead-free alloys.
RE L0 to EN and IPC standards
SnPb(Ag) : 0,6%, 0,9% and 1,4% of flux content (IF 14-06, IF 14-09, IF 14-14)
Lead-free :1,6% and 2,2% of flux content (IF 14-16 and IF 14-22)