Interflux

Solder Paste

Low melting point solder pastes

DP 5600

Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)


LMPA™-Q6

Interflux®LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00%

  • Enhanced low melting point solder paste
  • High stability on the stencil
  • Absolutely halide-free
  • Smooth, clear and transparent residue
  • Low voiding
  • Reduced cost of production
  • Increased mechanical reliability

Lead-free solder pastes

µ-dIFe 7

Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications


DP 5505 lead-free

Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free alloys. DP 5505 is also available in SnPb(Ag) alloys.
High printing speeds
Low Voiding
RO L0 to EN and IPC standards

IF 9057 lead-free

Interflux® IF 9057 is a no-clean solder paste in lead-free alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering. IF 9057 is also available in SnPb(Ag) alloys.


Lead-based solder pastes

IF 9009LT

Interflux® IF 9009LT is a no-clean solder paste with increased activity in SnPb(Ag) alloys. IF 9009LT is also available in lead-free alloys.


IF 9057

Interflux® IF 9057 is a no-clean solder paste in SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering. IF 9057 is also available in lead-free alloys.