Silicone Encapsulants

Silicone Encapsulants & Potting Compounds

The practice of using silicone in encapsulating and potting electronic components is a well-established process designed to protect delicate circuitry. This protection may be required for a number of reasons including, but not limited to: mechanical shock, thermal shock, vibration, chemical attack, humidity, extreme temperatures and wide thermal cycles. In addition to providing protection, the encapsulant may also be used to perform other functions, such as thermal transfer and/or light emission.

Although the end function may appear simple and straightforward the operating conditions, component design and production methods often place heavy demands on the encapsulant and require very meticulous product selection and testing. There are a variety of materials on offer including polyurethanes, epoxies, silicones and many other polymers – each system will have advantages as well as limitations. It is, therefore, important to fully understand the chemical and physical properties of each system and carefully match these to the requirements of the component and manufacturing processes.

For more information, download our guide to Silicone Encapsulants.

Why use Silicone Encapsulants?

Silicone polymers and elastomers have particular inherent physical properties including:

  • Wide operating temperature range from -115 to +300ºC
  • Excellent electrical properties
  • Flexibility
  • Hardness range: soft gels to moderately hard rubbers
  • UV resistance
  • Good chemical resistance
  • Resistance to humidity and water
  • Ease of use
  • Resistance to fungus – silicones do not promote fungus growth

These natural properties can be further enhanced using fillers and chemical additives to provide additional features when needed, including flame retardancy, thermal conductivity, electrical conductivity and adhesion. Through the selection of polymers and fillers it is also possible to adjust viscosity and rheology and the final hardness and modulus of the cured rubber.  Control of the curing regime and speed can be achieved using silicone chemistry to produce both heat and room temperature cure systems and both 1- and 2-part systems can be supplied.  Silicone encapsulants are extremely versatile and provide design engineers with a wide product choice.

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Choice of Silicone Encapsulant

There are three key considerations when choosing an encapsulant for any application:

  • What are the operating and environmental conditions of the finished product?
  • What physical properties does the encapsulant require?
  • How will you process the material?

Due to the complexity of product design and the individual manufacturing process, it may not be possible to satisfy exactly all the requirements in every area, so there may well be a need for compromise. It is therefore, important to decide which criteria are essential for product performance and longevity.

We always recommend fully testing the suitability of the material in each given application and production method employed prior to specification. In some cases, it will be possible to provide a bespoke formulation in order to match the design requirements.

Temple 4’s’ technical staff have many years of application based experience and will be happy to help with the selection process.

For further information download our Encapsulants Product Information Sheet.

CODE DESCRIPTION
EGel3000 2-part silicone gel low viscosity  
EGel3002 2 Part silicone gel fast cure  
EGel3003 2 Part silicone gel low viscosity soft  
EGel3004 2 Part silicone gel thixotropic  
EGel3005 2 Part silicone gel low viscosity  
EGel3100 SILCOTHERM 2 Part silicone gel  
QGel330 Silicone gel tough high purity  
QGel331 Silicone Gel Flame Retardant UL approved  
QLE1102 2 Part silicone encapsulant optically clear  
QSil12 20:1 Condensation cure silicone encapsulant clear  
QSil216 10:1 Addition cure silicone encapsulant optically clear  
QSil218 10:1 Addition cure silicone encapsulant optically clear  
QSil222 10:1 Addition cure silicone encapsulant optically clear  
QSil229 1:1 Addition cure silicone encapsulant optically clear  
QSil550 2-Part Addition Cure Encapsulant  
QSil553 SILCOTHERM 2 Part Addition cure silicone encapsulant  
QSil556 2 Part Addition cure silicone encapsulant  
QSil573 SILCOTHERM 2 Part Addition cure silicone encapsulant  
SE2003 SILCOTHERM 2 Part Addition cure silicone encapsulant  
SE2005 2 Part Condensation cure silicone encapsulant
SE2010 SILCOTHERM 2 Part silicone gap filler  
SE2011 2-Part Self bonding potting compound  
SE3000 SILCOTHERM 2 Part Addition cure low viscosity  
Silcoset 101 2 Part condensation cure silicone encapsulant high temperature
Silcoset 105 2-part condensation cure silicone encapsulant
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