Interflux Solder Paste. 

We are proud to supply the full range of innovative solder paste from Interflux, enabling us to offer a comprehensive range of high-quality Lead-free & Leaded solder wire to the UK market, at a competitive price point. We offer next day delivery on all stocked solder wires ordered before 2pm.

LMPA Q6

Part Number: ifspq6t4

Next day delivery on in stock items ordered before 2pm

Exclusive UK Partner

Interflux®LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00%

  • Enhanced low melting point solder paste
  • High stability on the stencil
  • Absolutely halide-free
  • Smooth, clear and transparent residue
  • Low voiding
  • Reduced cost of production
  • Increased mechanical reliability

LP 5720

Part Number: ifspq6t4

Next day delivery on in stock items ordered before 2pm

Exclusive UK Partner

IInterflux® LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
LP 5720 is the successor of DP 5505.
RO L0 to IPC and EN standards.
Halide content 0,00%

  • High stability on the stencil
  • Absolutely halide-free
  • For SnPb(Ag) alloys
  • For Lead-free alloys
  • Transparent post reflow residue

DP 5505

Part Number: if5505

Next day delivery on in stock items ordered before 2pm

Exclusive UK Partner

Interflux® DP 5505 is our general purpose, high stability, no-clean solder paste in SnPb(Ag) and lead-free alloys.
Low voiding
High printing speeds
Suitable for Pin-in-Paste
Reduced head-in-pillow defect
RO L0 to EN and IPC standards
Halide content: 0,00%

  • For reflow soldering
  • For stencil printing
  • For dispensing
  • Absolutely halide-free
  • Lead-free alloys
  • SnPb alloys

Next day delivery on in stock items ordered before 2pm

Exclusive UK Partner

Interflux® DP 5600 is a no-clean solder paste for low-temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Halide content: 0,00%
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)

  • For reflow soldering
  • For stencil printing
  • For dispensing
  • Absolutely halide-free
  • Low melting temperature
  • Low voiding

µ-DIFE 7

Part Number: ifudif7

Next day delivery on in stock items ordered before 2pm

Exclusive UK Partner

Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Repeatable and selective paste volume
Fast and easy application
Reduced risk of bridging on μ-BGAs
Suitable for the ERSA Dip&Print Station
For Ball Grid Arrays, J-lead and Gull Wing ICs
RO L0 to EN and IPC standards
Halide content: 0,00%
  • For reflow soldering
  • For rework & repair
  • For dipping
  • Absolutely halide-free

News.

Contact

Let us suggest the best solution for your particular application, from our extensive range of products and services.

24 hour delivery

We maintain a large stock in our warehouse in Petersfield enabling fast and reliable delivery.
Orders@temple4.com

Office

Unit 19, Buriton Business Park, Petersfield, Hants, GU32 3NJ
Info@temple4.com
Tel: 01730 888499

Full in-house technical support

We are renowned for our high levels of customer support whether via phone, email, or on-site.
Techincal@temple4.com

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